Industrial Thermoset Plastics
Molding compounds generally used for encapsulating intrinsically safe electronics

The Epoxy chemistry is one of the most common chemistries used for encapsulating electronics for intrinsic safety. There are alternates in case the epoxy chemistry just doesn't meet the requirements your product needs to withstand. Below is some general information that may help you choose one chemistry over another. Within these 4 chemistries there are hundreds of different formulations to choose from. Each formulation has different properties. Industrial Thermoset Plastics has hundreds of materials in stock and access to many times more. If you are building a product that needs encapsulation for intrinsic safety you can contact us with your requirements to help choose a suitable material for your project.

Chemistry Flame
Retardant
Deg C
Temp range
UL
Approved
Thermally
Conductive
Thermally
Insulative
Hardness
Epoxies Yes neg 60 to 260 Yes Yes Yes flex / rigid
polyurethanes Yes neg 60 to 115 Yes Yes Yes flex / rigid
silicones Yes neg 100 to 316 Yes Yes Yes only flexible
ceramics Yes up to 1800 Yes Yes No only rigid
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Industrial Thermoset Plastics  7675 Jenther Dr  Mentor, Ohio 44060

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